Micro-fluid Channel Embedded in LTCC Board Using a Low-Cost Fabrication Method

Abstract

In electronic communication device fabrication, the high density integration of chips and devices in board requires the board to have good heat dissipation performance. Embedding micro-fluid channel into LTCC board is an optimal way. In this paper, a low-cost fabrication method of LTCC board with embedded micro-fluid channel was proposed. The experimental results demonstrated the effectiveness of this method for preventing the micro-fluid channel from excessive deformation or collapse. Owing to use silver pastes instead of gold pastes, the fabrication cost of LTCC board was reduced by more than 20%, which would promote the application of LTCC boards in commercial use, such 5G communication and embedded systems.