The Optimization of Ball Shear Strength Using a Computational Model

Abstract

Nowadays, Ball Grid Array, BGA technologies are prevalent through the IC packaging industry. Among them are larger numbers of I/Os, leading to many advantages over conventional ones and low cost assemblies for mass production. BGA packages are compatible with surface mount technology (SMT). BGA uses solder joints as surface mount components (SMC). It is not only used for the conduction of electrical signals, power and ground. It also acts as mechanical support to hold the package in position on a printed circuit board (PCB). Thus, solder joint strength is a major concern for BGA packages. To evaluate the strength of the solder joint attached to the package and PCB, a popular method to use is the ball shear test. In this study, the focus of interest was on the size of the ball, the diameter of solder resistance opening, ball height and shear tool clearance by using finite element method. The experiment design aimed to find out the best conditions for the ball. The results were validated by other authors for suitable correlation. The standard deviation of the parameters concerning ball shear test value was also defined