Analysis on the Reason of Blistering Delamination of Copper Clad Laminate

Abstract

Copper clad laminate was delaminated after producing. In order to found out the invalidation reason, scanning electron microscope was employed to analyze the samples. It was showed that the invalidation reason was different as the invalidation had happened at the different position of the laminate. On the delamination of the central section of copper clad laminate, a smooth boundary was seen and no crack initiation formed so it was clear that there was no bonding between substrate board and copper film. While the delamination position was situated on the border of copper clad laminate, tearing crack was very clear. It was indicated the delamination was due to unreliable bonding.